ClassOne Technology has entered into a joint development agreement with IBM Research to advance wet processing solutions for semiconductor manufacturing, focusing on…
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May 20, 2025
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GlobalFoundries (Nasdaq: GFS) has signed a Memorandum of Understanding (MOU) with Singapore’s Agency for Science, Technology and Research (A*STAR) to accelerate research…
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NewsPower ElectronicsProduct LaunchSemiconductorsTechnology
Toshiba Shrinks Power Loss with New 650V SiC MOSFETs
Toshiba Electronic Devices & Storage Corporation has released four new 650V silicon carbide (SiC) MOSFETs incorporating its latest third-generation chip technology. Housed…