GlobalFoundries (Nasdaq: GFS) has signed a Memorandum of Understanding (MOU) with Singapore’s Agency for Science, Technology and Research (A*STAR) to accelerate research and development in advanced semiconductor packaging technologies.
Under the agreement, GlobalFoundries (GF) will gain access to ASTAR’s R&D infrastructure and technical expertise, while contributing advanced equipment to support ASTAR’s ongoing research. The collaboration aims to fast-track the development and deployment of compact, high-performance, and energy-efficient semiconductor packaging solutions—critical for data-intensive applications including artificial intelligence (AI), data centers, and next-generation communication technologies such as 5G and 6G.
“With a robust semiconductor ecosystem and strong R&D support, Singapore is an ideal location for us to scale our innovations at the foundry level,” said Gregg Bartlett, Chief Technology Officer at GlobalFoundries. “This aligns with our global roadmap and commitment to delivering more energy-efficient chips for the AI era.”
The partnership will be anchored at GF’s Singapore manufacturing facility, which will serve as a comprehensive center for semiconductor manufacturing, packaging, and testing. The MOU also includes talent development programs aimed at equipping GF employees with expertise in advanced packaging, reflecting both organizations’ commitment to long-term industry growth.
A*STAR Executive Director Terence Gan highlighted the importance of public-private R&D partnerships in strengthening Singapore’s role in the global semiconductor supply chain. “We look forward to working closely with GlobalFoundries to accelerate innovation and talent development in this critical domain,” he said.
The move follows GF’s January announcement to establish an Advanced Packaging and Photonics Center in New York. Both initiatives are part of the company’s broader strategy to expand advanced packaging capabilities across global markets.
