GlobalFoundries (Nasdaq: GFS) has signed a Memorandum of Understanding (MOU) with Singapore’s Agency for Science, Technology and Research (A*STAR) to accelerate research…
Tag:
advanced packaging
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BusinessNewsProduct LaunchSemiconductorsTechnology
Siemens Expands TSMC Collaboration with Certified Tools for Next-Gen Chip Innovation
Siemens Digital Industries Software has announced an expanded collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to accelerate innovation in semiconductor design and…
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BusinessDefense & AerospaceMarketNewsTelecommunications
StratEdge Taps Coastal RF Systems as Exclusive Rep for Southern California Market
The high-performance semiconductor packaging solutions firm, StartEdge Corporation appoints Coastal RF Systems as its exclusive Manufacturer’s Representative for Southern California. The partnership…
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BusinessNewsSemiconductorsTechnology
Amkor, TSMC Strengthens Partnership on Advanced Packaging in Arizona
by EC Editorby EC EditorUS-based OSAT (outsourced semiconductor assembly and test) firm, Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM), the Taiwanese semiconductor…
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NewsProduct LaunchSemiconductorsTechnology
Alphawave Introduces First Silicon-Proven 3nm, 24Gbps UCIe IP Subsystem with TSMC CoWoS Technology
by EC Editorby EC EditorUK-based high-speed connectivity and compute silicon provider, Alphawave Semi (LSE: AWE) unveils industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die…