Caliber Interconnects Pvt. Ltd., a semiconductor design and test house specializing in high-density PCB layouts and advanced packaging, announced it has accelerated turnaround times and achieved first-time-right outcomes for complex chiplet and Automated Test Equipment (ATE) hardware projects. The company attributes these gains to its proprietary workflow, which integrates Cadence Allegro and Sigrity technologies to optimize performance, power, and reliability from the earliest stages of design.
Caliber’s methodology enhances the efficiency and precision of designing intricate IC packages and dense PCB layouts. Using Cadence Allegro, engineers can leverage features such as sub-drawing management and auto-routing to work in parallel across circuit blocks, compressing project timelines by up to 80%. The framework is reinforced with in-house verification processes and custom automation utilities developed through Allegro SKILL-based scripting, ensuring quality consistency and adherence to design rules.
To meet the demands of next-generation interconnects exceeding 100 Gbps, Caliber employs Cadence Sigrity X PowerSI and Sigrity X PowerDC simulation tools. These platforms allow engineers to analyze signal integrity, crosstalk, and power delivery network (PDN) impedance, while evaluating IR drop, current density, and Joule heating. This comprehensive assessment ensures reliable design sign-off, minimizing costly re-spins and accelerating time-to-market for customers.
“Our team has elevated our engineering leadership by creating a disciplined workflow that delivers exceptional quality and faster turnaround times for our customers across the semiconductor ecosystem,” said Suresh Babu, MD of Caliber Interconnects. “Integrating Cadence’s advanced design and simulation environment into our proprietary methodology empowers us to push the boundaries of performance and reliability in complex chiplet and ATE hardware design.”
