Taiwan-based embedded systems manufacturer NEXCOM has launched the EBC 370 and EBC 370X, compact edge AI computing platforms designed to meet the demands of next-generation autonomous robotics and industrial automation applications.
The new 3.5-inch single board computers (SBCs) are powered by 13th Gen Intel® Core™ processors and Intel® Iris® Xᵉ Graphics, enabling high-performance computing and real-time data processing in space-constrained industrial environments. Designed for robotics control, visual computing, and deep learning tasks, the EBC 370 series is aimed at applications ranging from humanoid and quadruped robots to CNC machinery and automated inspection systems.
“The EBC 370/EBC 370X is an AI-powered, PC-based controller designed to adapt to the most demanding conditions,” said Peter Yang, President of NEXCOM. “The high-performance CPU provides the processing power that robotics engineers need and delivers stable operations within dynamic industrial environments.”
Equipped with up to 32GB DDR5 memory and an MXM slot, the platform supports additional GPU or AI accelerator modules, offering flexibility in deployment and upgrade paths. Unlike traditional systems with full-sized PCIe cards, the MXM slot allows modular GPUs to be integrated seamlessly, conserving space while maintaining advanced AI capabilities.
Connectivity features include four 2.5GbE LAN ports for high-speed interfacing with multiple IP cameras, enabling rapid image capture, object recognition, and remote data streaming. Three USB 3.2 Gen2 ports support integration with LiDAR modules and depth cameras, essential for autonomous mobile robots (AMRs) navigating unstructured or human-free environments.
For wireless communication, the onboard M.2 slot supports 5G/LTE modules, ensuring low-latency, high-bandwidth connectivity for industrial edge deployments. The ruggedized EBC 370X variant supports a wide operating temperature range of -20°C to 70°C, tailored for harsh or fluctuating field conditions. Multiple RS-232/422/485 COM ports ensure compatibility with a broad array of legacy and modern industrial peripherals.