Power electronics chip company SiCSem performed groundbreaking ceremony here on Saturday for setting up the country’s first end-to-end silicon carbide semiconductor production…
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Intel CEO to Visit Odisha for 3DGS Ground-Breaking Ceremony; Production Likely in 2 Yrs: Official
by EC Editorby EC EditorPC chip major Intel CEO Lip-Bu Tan is likely to visit Odisha later this year for the ground-breaking ceremony of 3D Glass…