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News Product Launch
Nepes Laweh Successfully Produces World’s First 600mm x 600mm Large Panel Level Packaging

by EC Editor December 24, 2021

by EC Editor December 24, 2021

Nepes Laweh Corporationi (KOSDAQ 033640: Nepes) completes successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using…

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Recent Posts

Laser Photonics’ New R&D Initiative Aims to Accelerate Innovation
December 2, 2024
German Government Plans Billions of Euros In New Chip Subsidies: Report
December 2, 2024
Peak Technology Powers Up its Muscles with Type A Machines Acquisition
November 28, 2024
Renesas Introduces RZ/T2H MPU for Industrial Equipment
November 27, 2024
Lattice Semiconductor Considers Offer For Intel’s Altera Unit
November 26, 2024

Editor’s Picks

German Government Plans Billions of Euros In New Chip Subsidies: Report
December 2, 2024
Peak Technology Powers Up its Muscles with Type A Machines Acquisition
November 28, 2024
Lattice Semiconductor Considers Offer For Intel’s Altera Unit
November 26, 2024
Semiconductor Manufacturing firm Wolfspeed Brings Melissa Garrett as SVP & General Counsel
November 26, 2024
Nanoscale Transistors Could Enable More Efficient Electronics
November 25, 2024
Ex-Intel, ARM Executive Tom Lantzsch Joins Cerebras’s BoD
November 25, 2024

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