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Adeia Signs Hybrid Bonding License Agreement with Hamamatsu Photonics

by EC Editor July 24, 2024

by EC Editor July 24, 2024

Adeia Inc. (NASDAQ: ADEA) has signed a new license agreement with Hamamatsu Photonoics K. K. for Adeia’s semiconductor IP portfolio covering die-to-water…

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Apple to Strip Secret Robotics Unit From AI Chief Weeks After Moving Siri
April 25, 2025
ChEmpower Powers Up with $18.7M for Scratch-Free Chipmaking
April 25, 2025
George Holmes Named CEO as UBILITE Strengthens Executive Bench
April 25, 2025
NTT DATA, Neysa Ink MoU with Telangana Govt to Set Up Rs 10,500 Cr AI Data Centre Cluster
April 24, 2025
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April 24, 2025

Editor’s Picks

Apple to Strip Secret Robotics Unit From AI Chief Weeks After Moving Siri
April 25, 2025
George Holmes Named CEO as UBILITE Strengthens Executive Bench
April 25, 2025
NTT DATA, Neysa Ink MoU with Telangana Govt to Set Up Rs 10,500 Cr AI Data Centre Cluster
April 24, 2025
Kioxia’s Portable SSD Wins Red Dot Award for Product Design 2025
April 24, 2025
Next-Gen SoC Prototyping Gets a Lift from S2C-Andes Tie-Up
April 23, 2025
Okika Acquires Anadigm, Eyes Analog IC Breakthrough
April 23, 2025

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