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Home » Next-generation packaging technology

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Next-generation packaging technology

News Product Launch Semiconductors Technology
LG Chem Launches Liquid and Film PID for IC Substrates

by EC Editor September 29, 2025

by EC Editor September 29, 2025

LG Chem has completed the development of a proprietary liquid photo-imageable dielectric (PID), a key material for advanced semiconductor packaging, and is…

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