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IEEE Study Demonstrates Scalable Integration of Quantum Dot Lasers on Silicon Chiplets

by EC Editor July 11, 2025

by EC Editor July 11, 2025

A recent study published in the IEEE Journal of Lightwave Technology reveals a significant breakthrough in photonic integration, as researchers from the…

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Teledyne LeCroy Provides Support for IEEE 802.3ck Based 100GbE

by EC Editor March 14, 2022

by EC Editor March 14, 2022

Teledyne LeCroy, the provider of protocol test and measurement solutions, announces the support for IEEE 802.3ck based 100GbE four-level pulse amplitude modulation…

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Recent Posts

Diodes Unveils Programmable 4A Buck Converter for Automotive POL
December 5, 2025
IBM’s Leon Stok Takes Helm of Si2 Board to Drive Semiconductor Design Advancements
December 5, 2025
Robin Balen Named CPO as Vantage Builds Next-Gen Data Center Product Team
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Rigaku Debuts High-Precision MF-3400 for 3D NAND and AI Chips
December 5, 2025
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December 4, 2025

Editor’s Picks

IBM’s Leon Stok Takes Helm of Si2 Board to Drive Semiconductor Design Advancements
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December 5, 2025
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December 4, 2025
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xLight Scores $150M Federal Backing to Accelerate EUV Laser Innovation
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