Global Unichip Corp. (GUC) and Ayar Labs have entered into a strategic partnership aimed at accelerating the integration of co-packaged optics (CPO)…
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advanced packaging
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BusinessNewsSemiconductorsTechnology
Amkor Expands Arizona Semiconductor Campus with $7 Billion Investment
by EC Editorby EC EditorAmkor Technology Inc. (Nasdaq: AMKR) has broken ground on a new state-of-the-art semiconductor advanced packaging and testing campus in Peoria, Arizona, expanding…
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AI / AR / VRBusinessData CenterNewsProduct LaunchSemiconductorsTechnology
Ayar Labs, Alchip, TSMC Drive Next-Gen AI Systems With Optical I/O
by EC Editorby EC EditorAyar Labs and Alchip Technologies have formed a strategic partnership to accelerate the adoption of co-packaged optics in large-scale artificial intelligence infrastructure,…
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NewsProduct LaunchSemiconductorsTechnology
Rigaku Begins Mass Production of Breakthrough X-ray Tool for Semiconductors
by EC Editorby EC EditorRigaku Corporation, a leading Japanese developer of X-ray metrology systems, has launched mass production of its XTRAIA XD-3300, a high-resolution microspot X-ray…
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ClassOne Technology has entered into a joint development agreement with IBM Research to advance wet processing solutions for semiconductor manufacturing, focusing on…