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Home » 232-layer 3D NAND

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232-layer 3D NAND

News Product Launch Semiconductors Technology
Micron’s Tiny UFS 4.0: Power Packed, Compact Storage

by EC Editor February 28, 2024

by EC Editor February 28, 2024

Micron Technology introduces compact 9×13 mm UFS 4.0 mobile solution, featuring breakthrough firmware, 232-layer 3D NAND, and up to 1TB capacity. …

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Recent Posts

Telangana Govt Signs Rs 3,500 Crore MoU with ST Telemedia for AI-Ready Data Centre in Hyderabad
January 20, 2025
Vermont Tech Hub Gets $24 Million, the Largest Research Awarded in UVM History
January 20, 2025
Intel Shares Jump on Report It’s an Acquisition Target
January 20, 2025
Taiwanese ASIC Firm Alchip Opens 3DIC ASIC Design Services
January 17, 2025
Holographix Launches Microlens Array Design Services to Address the Growing Market
January 17, 2025

Editor’s Picks

Telangana Govt Signs Rs 3,500 Crore MoU with ST Telemedia for AI-Ready Data Centre in Hyderabad
January 20, 2025
Vermont Tech Hub Gets $24 Million, the Largest Research Awarded in UVM History
January 20, 2025
Intel Shares Jump on Report It’s an Acquisition Target
January 20, 2025
Taiwanese ASIC Firm Alchip Opens 3DIC ASIC Design Services
January 17, 2025
Holographix Launches Microlens Array Design Services to Address the Growing Market
January 17, 2025
onsemi Strengthens Power Solutions with Qorvo’s Silicon Carbide JFET Technology
January 16, 2025

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