High-performance analog and mixed-signal IP successfully tape-out of a chip on the TSMC N2P process including a novel temperature sensor design and an expanded portfolio of clocking IP to support next-gen semiconductor products.
The newly developed temperature sensor using N2P technology marks a departure from traditional BJT-based temperature sensing methods. This innovative design is compatible with current leading-edge semiconductor fabrication processes while offering a complete and SoC integration-friendly temperature monitoring solution. By addressing evolving industry needs, this sensor underscores Silicon Creations’ commitment to innovation within existing and future semiconductor technologies.
In addition to the temperature sensor, the chip on the TSMC N2P process expands Silicon Creations’ silicon-proven 2nm portfolio, which includes a wide range of precision clocking solutions such as phase-locked loops (PLLs) and oscillators. As an industry leader in both clocking IP – including ring-based and LC-based PLLs – and high-speed interface IP (SerDes), Silicon Creations continues to set the standard for high-performance, reliable, integration-friendly designs.
Silicon Creations’ new portfolio includes jitter-optimized, power-optimized, and area-optimized phase-locked loops (PLLs), fast-frequency-hopping frequency-locked loops (FLLs), free-running oscillators, low-noise crystal oscillators, and low-noise clock buffers.
With over 700 unique IP products, including more than 450 PLLs, Silicon Creations continues to prioritize high-quality, integration-friendly designs. The company’s ISO-9001 certification underscores its commitment to stringent quality standards, ensuring performance across process, voltage, and temperature (PVT) variations. Comprehensive silicon testing and detailed test reports help reduce customer risk and accelerate time-to-market.
A longstanding member of the TSMC Open Innovation Platform (OIP) Ecosystem, Silicon Creations has played a role in over 1,600 mass production chips and 12 million 12-inch wafers. The company has received the TSMC OIP Partner of the Year award for eight consecutive years, reflecting its dedication to innovation and industry collaboration.
