Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and robotics solutions, has announced the launch of the Magnum 7H, its next-generation memory tester designed to support the increasing demand for high bandwidth memory (HBM) devices used in artificial intelligence and high-performance computing applications.
The Magnum 7H has been developed to deliver high parallelism, speed, and accuracy in testing HBM stacked dies, which are widely deployed in systems integrating GPUs and accelerators for AI and cloud infrastructure. According to Teradyne, volume production using the new tester is already underway at some of the industry’s largest HBM manufacturers.
Designed to support multiple HBM standards—including HBM2E, HBM3, HBM3E, HBM4, and HBM4E—the Magnum 7H provides broad test coverage across the manufacturing process. This includes testing at the base-die wafer stage, memory core test, and burn-in. It also supports both pre-singulated Known-Good-Stack-Die (KGSD) testing with traditional probe cards, and post-singulated die testing using advanced probing and handling solutions.
Among the key features of the Magnum 7H is its enhanced power delivery performance, with faster Dynamic Power Supply (DPS) response time, which contributes to improved device yield. The system integrates both high-speed memory testing and logic testing capabilities, supported by a flexible algorithmic pattern generator and Teradyne’s Logic Vector Memory (LVM) option. The tester also includes a Fail List Streaming (FLS) feature that enables faster and more detailed error detection.
The platform is capable of testing HBM3 and HBM4 devices at data rates up to 4.5Gbps. To address the cost and efficiency requirements of high-volume manufacturing, the Magnum 7H offers high parallelism, supporting up to 9,216 digital pins and 2,560 power pins. This configuration enables greater probe efficiency and a reported 1.6x increase in production throughput.
As AI workloads and memory-intensive applications continue to grow, the demand for reliable and scalable HBM testing solutions is expected to rise. With the introduction of the Magnum 7H, Teradyne aims to support semiconductor manufacturers in delivering next-generation memory products with greater speed, accuracy, and production efficiency.
