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Teradyne Launches Titan HP to Test Next-Gen AI, Cloud Chips

Teradyne Launches Titan HP to Test Next-Gen AI, Cloud Chips

Teradyne Inc. (NASDAQ: TER), a supplier of automated test equipment and advanced robotics, has introduced its Titan HP system level test (SLT) platform, targeting the rising performance demands of artificial intelligence and cloud infrastructure devices.

The launch comes as shrinking process nodes and new architectures push the limits of device complexity, power consumption, and thermal management in high-volume manufacturing. SLT has become a critical step in ensuring that advanced semiconductors perform reliably under real-world conditions, particularly as workloads in AI and data centers surge.

The Titan HP is already in production at several large customers, according to the company. It supports up to two kilowatts of power today, with plans to extend capacity to four kilowatts, giving manufacturers a forward-looking option as next-generation chips demand more energy and stricter thermal compliance.

“Teradyne Titan HP represents a significant advancement in testing the leading-edge devices powering today’s AI and cloud infrastructure,” said Jason Zee, vice president and general manager of Teradyne’s Integrated Systems Test division. He emphasized the platform’s innovations in thermal control and power delivery, backed by the company’s global customer support network.

The Titan HP includes multiple thermal management features designed to maintain device reliability while sustaining high yields. These include a multi-branch cold plate architecture for cooling both the device under test (DUT) and supporting components, asynchronous cooling with PID-tuned thTeradyne Launches Titan HP to Test Next-Gen AI, Cloud Chipsermal control to prevent overheating, and an optional DUT heater that enhances automated temperature control for more precise testing.

Teradyne said the platform enables mission-mode testing for the most demanding devices used in AI and cloud deployments. By simulating operational conditions, the system ensures chips meet rigorous quality standards before deployment in data centers and other high-performance environments.

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