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Home » Product Launch » Teradyne Introduces 224G PHY Tester for Silicon Photonics and Chiplets

Teradyne Introduces 224G PHY Tester for Silicon Photonics and Chiplets

TeradyneUltraflexplus

Teradyne, Inc. (NASDAQ: TER), a provider of automated test equipment and advanced robotics, announced the launch of its UltraPHY 224G for UltraFLEXplus, a new instrument designed to extend the company’s high-speed PHY performance testing capabilities. The introduction follows Teradyne’s existing UltraPHY 112G, which has already been adopted by multiple customers. Both instruments leverage Teradyne’s IG-XL software, facilitating easier adoption and streamlined test development.

The UltraPHY 224G, developed with Multilane modules, offers bench-quality signal generation and measurement for production testing. It is engineered to meet rigorous hardware and software standards, targeting next-generation semiconductor interfaces, including chiplet-based architectures, advanced packaging, and Known Good Die (KGD) workflows.

“With the introduction of Teradyne UltraPHY 224G, we are extending our portfolio to meet the most demanding next-generation PHY test requirements,” said Roy Chorev, Vice President and General Manager of Teradyne’s Compute Test Division. “Customers can be confident that their UltraPHY investments support both today’s and tomorrow’s technologies.”

While the UltraPHY 112G addresses current high-speed standards, the UltraPHY 224G expands performance to accommodate emerging data rates in data center and silicon photonics (SiPh) markets. Both instruments are compatible with the UltraFLEXplus platform, enabling the coexistence of 112G and 224G modules for maximum testing flexibility.

The UltraPHY 224G provides eight full-duplex differential lanes plus eight receive-only differential lanes per instrument. It supports data rates up to 112 Gb/s NRZ and 224 Gb/s (112 Gbaud PAM4) through a DSO + BERT architecture. The platform is scalable, supporting multiple instruments per UltraFLEXplus system and extending to advanced modulation formats as industry standards evolve.

Key features include integrated DSO, AWG, and BERT capabilities, over 50 GHz signal delivery bandwidth, and a fully integrated production test solution. The architecture allows streamlined diagnostics, reduces development time, and supports both SiPh and non-SiPh devices, with Teradyne providing a single point of contact for service and support.

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