LG Chem has completed the development of a proprietary liquid photo-imageable dielectric (PID), a key material for advanced semiconductor packaging, and is now positioning itself to serve the growing demand in AI and high-performance semiconductor markets.
PID, a photosensitive dielectric, forms ultra-fine interconnects between semiconductor chips and substrates, enhancing circuit fidelity, device reliability, and overall performance in advanced packaging processes. With semiconductor devices becoming increasingly dense, high-resolution PID has become critical to meeting stringent performance requirements.
LG Chem’s liquid PID boasts high-resolution patterning, low-temperature curing, and low shrinkage with minimal moisture absorption, improving process stability for manufacturers. The material also adheres to environmental compliance standards, eliminating per- and polyfluoroalkyl substances (PFAS) and avoiding organic solvents such as N-methyl-2-pyrrolidone (NMP) and toluene, reflecting rising regulatory scrutiny.
Beyond liquid PID, LG Chem is accelerating the development of film-type PID for advanced integrated circuit (IC) substrates. Film PID addresses challenges in scaling larger substrates with finer features, where differences in thermal expansion can increase the risk of cracking. Traditional liquid PIDs have struggled with double-sided application and uniform coating on large panels.
LG Chem’s film PID is supplied as an attachable film, maintaining uniform thickness and pattern fidelity across large substrates. Its combination of strength, elasticity, and low moisture absorption reduces the likelihood of cracking under repeated thermal cycling. Importantly, the film can be applied using existing lamination equipment, enabling seamless adoption for substrate manufacturers without process modifications.
The company is collaborating with leading global semiconductor firms to advance joint programs and accelerate adoption of both liquid and film PID solutions. These efforts aim to expand LG Chem’s footprint in advanced packaging materials and strengthen its position against historically dominant Japanese suppliers.
LG Chem CEO Shin Hak-cheol said, “We are proactively addressing our customers’ needs for advanced packaging innovation across a broad materials portfolio. We are committed to going beyond simple material supply to shape new industry trends with our customers.”
In addition to PID, LG Chem is scaling up mass production and development of critical back-end semiconductor materials, including Copper-Clad Laminates (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF), consolidating its role in next-generation semiconductor packaging and high-performance electronics.
