Resonac Corporation (TOKYO:4004) develops a temporary bonding film. The new film can be used for supporting a wafer on a glass carrier…
Category:
Technology
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BusinessNewsSemiconductorsTechnology
Biden-Harris Administration Awards $269M for Microelectronics Manufacturing and Workforce Development; Boosting U.S. Chip-Making Capabilities
by EC Editorby EC EditorThe Department of Defense today announced a significant boost to America’s microelectronics manufacturing capacity and workforce development infrastructure with $269 million in…
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BusinessNewsSemiconductorsTechnology
Maharashtra is Growth Engine of India – Shinde
by EC Editorby EC EditorChief Minister Eknath Shinde on Wednesday inaugurated Maharashtra’s first semiconductor manufacturing facility, which he described as a revolutionary step. Addressing attendees at…
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NewsProduct LaunchSemiconductorsTechnology
SiFive Brings Intelligence XM Series to Accelerate AI Workload
by EC Editorby EC EditorThe gold standard for RISC-V computing, SiFive, Inc. introduces SiFive Intelligence XM Series to help accelerate high-performance AI workloads. Intelligence SM becomes…
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BusinessNewsSemiconductorsTechnology
ICAPE Group Set to Become a Leading PCB Distributor in Japan with NTW Acquisition
by EC Editorby EC EditorThe global technology distributor of PCB and custom-made electromechanical parts, The ICAPE Group (ISIN code: FR001400A3Q3, Ticker: ALICA), signs a contract to…