Finland-based Picosun Group delivers cutting-edge Atomic Layer Deposition (ALD) technology to ams Austria-based OSRAM for volume manufacturing of optical semiconductor devices.
ams OSRAM has invested in a fully automated PICOSUN Morpher production cluster, which can deposit multiple materials on a batch of wafers even during the same process run. PICOSUN Morpher’s flexibility and process variety offers key advantage, which enables volume production as well as the testing of new processes for R&D of future products.
The two companies have also collaborated in a public funded project FLINGO to develop new ALD materials and processes to improve the characteristics of LEDs, such as efficiency and durability. This collaboration will continue after the ALD system delivery with activities to further expand the use of ALD in optoelectronic semiconductor processing.
“We have been working with Picosun since 2010 and now with this investment we can bring our collaboration to the next level. We are very excited to have the PICOSUN Morpher F cluster platform installed in our cleanroom,” states Dr. Sebastian Taeger, at ams OSRAM.
“The optical semiconductor market is one focus area of Picosun today. It is a fast-growing market where we have a strong presence with our tailored solutions for compound semiconductor-based devices. We have had excellent collaboration with the ams OSRAM technical team during project FLINGO and during the system specification stage. The expertise from both companies has resulted in optimized ALD solutions to boost the performance of the customer’s products,” continues Dr. Christoph Hossbach, General Manager of Picosun Europe GmbH.
