ClassOne Technology has entered into a joint development agreement with IBM Research to advance wet processing solutions for semiconductor manufacturing, focusing on the development of non-NMP (N-Methylpyrrolidone) solvent alternatives for advanced packaging applications.
The collaboration aims to establish best known methods (BKMs) for using safer, non-NMP solvents in IBM’s semiconductor fabrication processes. NMP has traditionally been used across industries, including microelectronics, for material removal, but concerns over its environmental and health impacts are driving the search for alternatives.
ClassOne, a longtime supplier to IBM since 2014, brings its expertise in electroplating, metal lift-off, and wet cleaning technologies to the project. The company has played a significant role in supporting IBM’s evolving needs in advanced packaging technologies.
“This collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing,” said Byron Exarcos, CEO of ClassOne Technology. “By combining our flexible wafer-processing platform with IBM’s deep research capabilities, we expect to deliver innovative, sustainable solutions that benefit the wider industry.”
The partnership reflects the industry’s growing shift toward more sustainable, high-performance manufacturing processes as demand for advanced packaging continues to rise across data-driven applications such as AI and 5G.
