Albuquerque, New Mexico-based 3D Glass Solutions Inc. (3DGS) raises an additional $4 million in an extended Series B1 Funding. The new round included new investor Menlo Microsystems Inc. along with existing follow-on investments from Corning Incorporated (NYSE: GLW) and Sun Mountain Capital. This brings the total fund raised in Series B1 to $24 million.
“The Series B1 round extension highlights the enthusiasm of both existing and new investors in 3DGS technology and growth initiatives,” said Mark Popovich, CEO and president of 3DGS, the company that expertise on the fabrication of electronic packages and devices using photo-definable glass-ceramics.
The extended Series B1 funding comes at a time when 3DGS secures a license agreement with Corning for process and know-how related to forming through glass vias (TGV) in Corning HPFS Fused Silica along with a corresponding long term supply agreement for glass wafers. The new technology complements 3DGS’ existing portfolio and provides entry into adjacent market areas.
The technology will initially be used for supply of components to Menlo Microsystems for its Ideal Switch. This will be a long-term supply agreement between 3DGS and Menlo Microsystems.
“Corning continues to believe in the versatility and benefits of through glass vias, or TGV, technology that will support the progression of glass use in the semiconductor industry, enabling the industry to facilitate innovative solutions supporting Moore’s Law,” said David Velasquez, vice president and general manager, Corning Advanced Optics. “We are looking forward to furthering our long-term partnership with 3DGS and its novel product and process capability that will advance this unique technology.”
“We are excited to strengthen our partnership with 3DGS and it underscores the importance of our longstanding strategic relationship in driving our Ideal Switch™ technology into many different segments,” said Russ Garcia, CEO of Menlo Micro. “As we continue to advance the most important electronic component since the transistor, the synergies between Menlo and 3DGS are growing. The development of glass processing and advanced glass packaging has become a critical element of the semiconductor supply chain, and we look forward to working together to bring exciting new products to the market in the years ahead.”
