Fujifilm Corporation has announced the completion of a new development and evaluation building at the Shizuoka Factory of FUJIFILM Electronic Materials Co., Ltd. (FFEM), the company’s core semiconductor materials unit. Operations commenced this month, marking a strategic step in Fujifilm’s efforts to accelerate the development of next-generation semiconductor materials and ensure a stable supply of high-quality products.
The Shizuoka expansion comes amid rapidly growing global demand for semiconductors driven by AI, 5G, and IoT technologies. Fujifilm’s semiconductor materials business has seen substantial growth, with sales increasing approximately 1.7 times between fiscal years 2021 and 2024, establishing it as a key driver of the Fujifilm Group’s overall growth. To support this trajectory, the company invested over 100 billion yen in facilities between FY2021 and FY2024, and plans an additional 100 billion yen or more from FY2025 to FY2026.
The newly completed facility features a high-cleanliness cleanroom equipped with state-of-the-art evaluation equipment, enhancing Fujifilm’s capabilities in performance and quality testing of development products. AI image recognition has been integrated into inspection processes to detect fine particles in semiconductor materials, improving analytical precision and supporting advanced quality control. A dedicated digital transformation (DX) department has also been established to integrate AI and other digital technologies into manufacturing processes, further boosting product reliability and stable supply.
Designed with business continuity planning in mind, the building features an RC column-head seismic isolation structure, and the cleanroom is situated 12 meters above ground level to mitigate flood risks. The Shizuoka Factory works closely with Fujifilm’s global R&D and production bases, supporting advanced process technology development for both domestic and international customers.
Fujifilm plans to leverage the new building to accelerate the development of advanced resists for EUV (Extreme Ultraviolet), ArF, and NIL lithography, PFAS-free materials, and the WAVE CONTROL MOSAIC™ line, which includes innovative color filter materials for image sensors. The facility will also bolster development and mass production systems for polyimides used in next-generation semiconductor packaging, addressing the rising demand for AI-focused semiconductors.
“This investment strengthens our development and production capabilities, positioning Fujifilm to lead in the advanced and next-generation semiconductor market, which is expected to double by 2030,” the company said in a statement.
Fujifilm provides a comprehensive range of materials for semiconductor manufacturing, spanning front-end to back-end processes, including photoresists, photolithography-related materials, CMP slurries, post-CMP cleaners, thin-film chemicals, polyimides, and high-purity process chemicals. The company continues to expand its global footprint with manufacturing and R&D bases in Japan, the United States, Europe, and Asia.
