VeriSilicon (688521.SH) has introduced a new wireless IP platform designed to accelerate the development of energy-efficient, highly integrated chips for a broad range of Internet of Things (IoT) and consumer electronics applications. The platform leverages GlobalFoundries’ 22FDX® 22nm FD-SOI process technology, enabling optimized wireless connectivity across short, medium, and long distances while delivering competitive power, performance, and area (PPA) metrics.
The platform provides comprehensive IP solutions covering multiple standards, including Bluetooth Low Energy (BLE), Bluetooth Dual Mode (BTDM), NB-IoT, and Cat.1/Cat.4, and integrates RF, baseband, and software protocol stacks. Additional RF IPs such as GNSS, 802.11ah, and 802.15.4g have already been adopted in multiple customer chip designs, achieving mass production.
By harnessing the low-power and high-integration advantages of FD-SOI technology, VeriSilicon has enabled customers to deploy competitive microcontrollers (MCUs) and system-on-chips (SoCs) for diverse markets. These include low-power BLE MCUs, Wi-Fi 802.11ah-based home security cameras, and multi-channel, high-precision GNSS SoCs. To date, more than 100 million chips based on these designs have been shipped, reflecting strong market adoption.
“Our 22FDX® process technology delivers an ideal combination of low power, high performance, and cost efficiency for today’s connected devices,” said Ed Kaste, Senior Vice President of GlobalFoundries’ Ultra-Low Power CMOS Product Line. “We are excited to see VeriSilicon leverage our process technology to provide flexible, high-performance solutions, helping accelerate innovation across diverse markets.”
VeriSilicon executives highlighted the platform’s flexibility and energy efficiency as key enablers for rapid product development. “As demand for low-power, multi-standard connectivity continues to grow in IoT and consumer markets, our wireless IP platform provides customers with a foundation to quickly develop connected devices,” said Wiseway Wang, Executive Vice President and General Manager of Custom Silicon Platform Division at VeriSilicon.
Wang added that VeriSilicon has licensed over 60 FD-SOI IPs to 45 customers, with more than 300 total licenses. The company was among the first to apply FD-SOI Adaptive Body Biasing (ABB) technology in mass-produced chips and has customized designs for 43 customers, with 33 already in production. The company plans to continue pushing FD-SOI innovation into emerging applications such as Wi-Fi 6, satellite communications, millimeter-wave radar, and hearing aids.
