Microchip Technology Inc. (Nasdaq: MCHP) has launched a new family of DualPack 3 (DP3) power modules featuring the latest IGBT7 technology, aiming to simplify system integration and boost power density across fast-growing industrial and sustainability markets.
The six new variants, available in 1200-volt and 1700-volt options with current ratings ranging from 300 to 900 amps, target applications including industrial motor drives, renewable energy systems, energy storage, traction, data centers and agricultural vehicles.
With compact dimensions of approximately 152 mm by 62 mm by 20 mm, the DP3 modules are designed to help manufacturers maximize power output without increasing footprint size. The advanced packaging eliminates the need to parallel multiple modules, reducing both system complexity and bill of materials costs. In addition, the modules serve as a second-source option to industry-standard EconoDUAL packages, giving customers more supply chain flexibility.
By leveraging IGBT7 technology, Microchip’s new DP3 modules cut power losses by 15% to 20% compared to earlier IGBT4 devices. They also maintain reliability under higher thermal stress, operating up to 175°C in overload conditions. These attributes enhance protection and control during high-voltage switching, improving both efficiency and durability.
“Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance,” said Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit. He added that the modules can be integrated into a comprehensive system solution with Microchip’s wider portfolio of microcontrollers, microprocessors, connectivity and security products, accelerating development and time to market.
The DP3 family is configured in a phase-leg topology, well-suited for general-purpose motor drives. They address challenges typically associated with power electronics, including dv/dt management, conduction losses, and driving complexity under overload conditions.
Microchip is positioning the DP3 modules to tap into accelerating demand for compact, efficient and reliable power conversion solutions. As industries transition to electrification and renewable energy, power modules with higher density and simplified integration are increasingly critical for reducing costs and improving sustainability.
The company’s broader power management portfolio spans analog devices, silicon and silicon carbide (SiC) technologies, as well as dsPIC® digital signal controllers and custom power module offerings.
