Deca Technologies has teamed up with Silicon Storage Technology, a subsidiary of Microchip Technology Inc., to develop non-volatile memory chiplet packages, in a bid to speed adoption of modular, multi-die semiconductor architectures.
The agreement comes as the chip industry confronts the rising cost and complexity of traditional monolithic designs. Chiplets – smaller, specialized components integrated into a larger package – are emerging as a favored strategy to improve performance and time-to-market while reducing expenses.
Deca will contribute its M-Series fan-out packaging and Adaptive Patterning technology, while SST is providing its SuperFlash embedded flash memory. Together, the companies are offering a bundled package that they say will simplify design, verification and commercialization of chiplet-based products.
The NVM chiplet package will integrate SST’s memory technology with interface logic and physical design, enabling it to operate as a standalone unit. Deca’s design rules, simulation flows and test strategies will be paired with manufacturing paths from its ecosystem of qualified partners.
The partners will support customers from design through prototype production, aiming to cut development cycles and lower the barriers to heterogeneous integration. By mixing advanced and legacy process nodes, chiplets promise flexibility that traditional scaling cannot deliver.
“Chiplet integration is reshaping how the industry thinks about performance, scalability and time to market,” said Robin Davis, Vice President of Strategic Engagements & Applications at Deca. “Our partnership with SST empowers customers to combine chips from multiple foundries, nodes and sizes into more efficient and cost-effective products.”
For chipmakers, the chiplet approach offers a “more-than-Moore” path to innovation – delivering new functionality without depending solely on shrinking transistors. It also allows reuse of existing IP and reduces risk in bringing new products to market.
“As our customers push the boundaries of Moore’s Law, they are expressing greater interest in chiplet-based solutions,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “This partnership aims to deliver IP, simulation tools and advanced assembly services needed for successful chiplet commercialization.”
The tie-up underscores the growing momentum behind chiplets as a mainstream semiconductor strategy. U.S. and Asian companies have poured resources into heterogeneous integration, while Europe and other regions are also ramping efforts. With global chip demand fueled by AI, cloud computing and advanced consumer devices, the ability to accelerate design cycles and optimize costs has become a competitive necessity.
By combining Deca’s packaging capabilities with SST’s flash memory expertise, the companies are positioning themselves to capture a larger share of an industry expected to shift rapidly toward chiplet-based system architectures in the years ahead.
