ams OSRAM has launched a new direct Time-of-Flight sensor that pushes the limits of resolution and spatial detection, a move that could influence how robots, smart devices, and consumer electronics interpret their surroundings. The TMF8829, announced this week, marks a significant improvement over previous-generation sensors, expanding resolution from the conventional 8×8 zones to 48×32, or 1,536 zones in total. That leap allows it to distinguish subtle differences between closely spaced or similar-looking objects, such as whether a coffee machine should fill an espresso cup or a tall travel mug.
The breakthrough highlights the growing role of high-resolution depth sensing in industries where precision and reliability are critical. Logistics robots that need to differentiate between nearly identical packages, smart building systems monitoring occupancy, or camera systems tracking movement in dynamic scenes all benefit from the richer data set. “The new dToF sensor supports precise 3D detection and differentiation in diverse applications — without a camera and with stable performance across varying targets, distances, and environmental conditions,” said David Smith, product marketing manager at ams OSRAM.
Direct Time-of-Flight technology works by emitting invisible infrared light pulses, which bounce off objects and return to the sensor. The time it takes for the light to travel back reveals the object’s distance, similar to how the delay of an echo indicates how far away a wall is. Multi-zone sensors capture reflected light from several viewing angles, creating a more detailed depth map of the environment. By increasing the number of zones twenty-fourfold over standard 64-zone sensors, the TMF8829 delivers finer spatial mapping that enhances accuracy across a range of applications.
Measuring just 5.7 by 2.9 by 1.5 millimeters, the TMF8829 is smaller than a cent coin and thinner than many existing low-resolution sensors, making it well suited for compact devices. Because it functions without a camera, it is compatible with privacy-sensitive applications such as smart home monitoring. At the same time, it can be paired with cameras to create hybrid vision systems, such as RGB Depth Fusion, which merges depth and color data to power augmented reality features like placing digital objects within physical spaces.
The device is classified as a Class 1 eye-safe product and uses a dual Vertical Cavity Surface Emitting Laser light source to measure distances of up to 11 meters with precision down to 0.25 millimeters. The sensitivity is high enough to register small movements such as finger swipes, while its 48×32 zones cover an 80-degree field of view similar to a wide-angle lens. On-chip processing lowers latency and simplifies integration, while its ability to deliver full histogram outputs enables artificial intelligence systems to extract more nuanced patterns from the raw data. The sensor also maintains performance under real-world conditions, such as when protective cover glass becomes smudged.
ams OSRAM’s investment in this new product reflects a broader strategy to lead in optical sensing technologies. The company holds more than 1,000 patent rights in vertical cavity lasers and 3D sensing, and it continues to expand its portfolio to meet growing demand for depth sensors that combine compact form factors with high accuracy. The TMF8829 is expected to be available commercially in the fourth quarter of 2025, targeting robotics, industrial automation, smart building systems, and consumer electronics that increasingly require precise, reliable, and privacy-conscious sensing capabilities.
