Taiwan-based semiconductor firm ASMedia Technology Inc. (TWSE: 5269) has completed its acquisition of Techpoint, Inc. (TSE: 6697), a U.S.-headquartered fabless semiconductor company known for its high-definition video connectivity technology. The all-cash transaction, valued at approximately US$390 million in fully diluted equity, marks a major step in ASMedia’s global expansion strategy.
The acquisition was finalized following the fulfillment of all closing conditions, including the delisting of Techpoint’s Japanese Depository Shares from the Tokyo Stock Exchange on May 29, 2025. The integration of Techpoint is expected to immediately contribute to ASMedia’s top-line growth and margin improvement, driven by product portfolio diversification and operational synergies.
ASMedia President Che-Wei Lin emphasized the strategic importance of the merger, citing complementary technologies and shared vision. “This acquisition marks the first step in ASMedia’s global expansion,” Lin said. “Techpoint brings exceptional talent and innovative solutions that will strengthen our position in AI, IoT, security, and automotive electronics.”
Techpoint CEO Hiro Kozato also expressed confidence in the merger. “Joining forces with ASMedia unlocks new opportunities for our team and technology development,” Kozato noted. “Our culture of engineering excellence aligns perfectly with ASMedia’s capabilities and ambition.”
The combined entity is expected to benefit from enhanced economies of scale, streamlined manufacturing, and supply chain efficiencies. ASMedia will also gain access to Techpoint’s established presence in the automotive and video surveillance markets—sectors experiencing rapid innovation and growing demand for high-performance semiconductor solutions.
Founded in 2004, ASMedia is a leading fabless semiconductor company specializing in high-speed transmission interface ICs, including USB, PCIe, and SATA controller chips. Techpoint, founded in 2012 and headquartered in the U.S., brings proprietary video connectivity solutions for next-generation automotive and security applications, with R&D and operational footprints across Asia and North America.
