Samsung Electronics Co., Ltd. unveiled its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. With the theme ‘Innovation Beyond Boundaries,’ the forum focused on addressing customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.
At the event, attended by over 700 guests from customer and partner companies, Samsung Foundry showcased its gate-all-around (GAA)-based advanced node technology, which is expected to support customers using AI applications. Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics, emphasized the company’s commitment to customer success.
Samsung Foundry announced several key initiatives as part of its business strategy. These include the expansion of applications for its 2-nanometer (nm) process and specialty process, the increase in production capacity at its Pyeongtaek fab Line 3, the launch of the Multi-Die Integration (MDI) Alliance for next-generation packaging technology, and continued progress in the foundry ecosystem with Samsung Advanced Foundry Ecosystem (SAFE™) partners.
The company revealed detailed plans for the mass production of its 2nm process, with the first phase targeting mobile applications in 2025, followed by HPC in 2026 and automotive in 2027. The 2nm process (SF2) offers improved performance, power efficiency, and reduced area compared to Samsung’s 3nm process. Mass production of the SF1.4 process is also scheduled for 2027.
Samsung Foundry aims to expand its offerings by providing foundry services for 8-inch gallium nitride (GaN) power semiconductors starting in 2025. Additionally, the company is developing the 5nm Radio Frequency (RF) process to meet the demands of the emerging 6G market. The 5nm RF process delivers increased power efficiency and reduced area compared to previous generations.
To meet customer demands and stabilize the supply chain, Samsung Foundry plans to expand its production capacity. This includes adding new manufacturing lines in Pyeongtaek, South Korea, and Taylor, Texas. The expansion will significantly increase the company’s clean room capacity by 2027.
In a bid to address the growing chiplet market for mobile and HPC applications, Samsung is launching the MDI Alliance. This collaboration with partner companies and major players in memory, substrate packaging, and testing aims to lead innovation in stacking technology and provide comprehensive turnkey services to support customers’ technological innovation.
Samsung Foundry also emphasized its commitment to partnerships and ecosystem development through the SAFE™ program. The company collaborates with a wide range of partners across the foundry ecosystem, offering design tools, packaging solutions, and intellectual property (IP) to meet customer needs in AI, HPC, and automotive applications.
The successful Samsung Foundry Forum 2023 sets the stage for future developments in semiconductor technology. Samsung Electronics plans to host similar events in South Korea, Europe, and Asia later in the year to engage with customers in each region. With its cutting-edge technology and collaborative approach, Samsung Foundry aims to drive innovation and support customers in the AI era.
